Solution Cases
This page introduces examples of solutions to customer issues utilizing the heat treatment technologies of JTEKT Thermo Systems. View a wide range of solutions including improvements that contribute to higher productivity, reduced CO2 emissions, and energy savings.
- All Cases
- Semiconductor
- FPD and Film Manufacturing
- Electronic Component Manufacturing
- Prototyping Experiments
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[case-027]Improving the Productivity of Contact Annealing Equipment for SiC Power Semiconductors
Productivity of our contact annealing equipment for SiC power semiconductors has been improved by reviewing and redesigning its transfer function.
- Contact annealing
- RLA-4100V
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[case-025] Improving Productivity of 8-inch Wafer
Productivity of activation annealing furnace and oxynitriding furnace for SiC power semiconductor has been improved to process 8-inch wafer at 100 wafers per batch.
- Nitride, Oxynitride
- Activation
- VF-5300HLP
- VF-5300H
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[case-024] Wafer Handling Robot Comptible with Difference in Wafer Pitches Between Devices
Treatment with 6 inch SMIF pod without compromising productivity is available by using wafer handling robot that can transfer wafer between devices with different pitches.
- Impurity diffusion
- Thermal oxideation
- Annealing
- VF-5100
- VF-5300(B)
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[case-023]Vacuum Load-lock Transfer Unit for Ramp Annealing Systems
Transfer system with vacuum load-lock improves product characteristics and throughput.
- Contact annealing
- RLA-4100V
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[case-019]Reduction of wafer transfer errors
Wafer transfer error is reduced by enabling the choice of timing of wafer suction
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[case-018]Improving the accuracy of detecting lamp disconnection
Improving the accuracy of detecting lamp disconnection by modification of software
- Annealing
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[case-017] Clean Oven System for Both Fan-Out Wafers and Si Wafers
Enable one clean oven system to be used for treatments of both Fan-Out wafers and Si wafers
- Polymide curing
- SO2-12-F
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[case-016] Low cost large bore vertical furnace
Cost reduction of large bore vertical furnace by optimizing required functions
- Curing (for FPD)
- VFS-4000
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[case-015] Large Batch Type Clean Oven System
Double the number of batches to improve productivity
- Other
- SO2-12-F
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[case-014] Handling of easily damaged thin wafers
Solves transport problems caused by cracking and chipping of thin wafers
- Annealing
- VF-5100