Solution Cases [case-029] Improving the Transfer Stability of Fan-Out wafer
- Packaging (Polyimide cure)
- VF-5700B
- SO2-12-F
In the FOWLP (Fan-Out Wafer Level Package) heat treatment process, the stability of wafer transfer has been improved by developing a dedicated boat and optimizing the shape of the robot hand.
| Support Process | Packaging (Polyimide cure) |
|---|---|
| Model Introduced | SO2-12-F, VF-5700B  |
Problem
During the FOWLP manufacturing process, Fan-Out wafer after molding is deformed when it is separated from the carrier. Subsequent heat treatment in the curing and redistribution processes further increases the deformation. Since the wafers deformed significantly are difficult to be transfered, they cannot be transferred stably.
Solution
- In order to minimize deformation of Fan-Out wafer during heat treatment, we have developed a special boat.
We can also design boats according to customer needs. - The hand shape of the transfer robot has been optimized to accommodate the transfer of deformed wafers.
Results
Optimization of the robot hand shape enables transfer of wafers with large deformations. (Supports warpage of up to ±5 mm)
In addition, the use of a dedicated boat has further improved stability during transfer.