Solution Cases [case-028]Improving the Productivity of Contact Annealing Equipment for SiC Power Semiconductors by adding Process Chamber and Reviewing the Transfer Mechanim

  • Contact annealing
  • RLA-4200V

Productivity of our contact annealing equipment for SiC power semiconductor has been improved by increasing the number of process chambers and reviewing its transfer mechanism (2 to 2.4 times higer productivity than conventional equipment).

Support Process Contact annealing
Model Introduced RLA-4200-V

Problem

Contact annealing equipment is a single-wafer system that processes one wafer at a time. Since its productivity is inferior to the batch system which processes multiple wafers in a cassette at once, there has been a need for productivity improvements.

Solution

Productivity has been improved by increasing the process chambers from 1 to 2 units, and reviewing the transfer mechanism.

Results

  • Productivity has been increased by 2 to 2.4 times (compared to our conventional equipment).
  • The footprint has been reduced by 24% compared to the installation of two of our conventional equipments.