Solution Cases [case-017] Clean Oven System for Both Fan-Out Wafers and Si Wafers
- Polymide curing
- SO2-12-F
Enable one clean oven system to be used for treatments of both Fan-Out wafers and Si wafers
| Support Process | Polyimide curing |
|---|---|
| Model Introduced | SO2-12-F |
Problem
Since Fan-Out wafers warp in the manufacturing process of FOWLP, wafer boats and fingers of the transfer robot for Fan-Out wafers differ from those for Si wafers. Therefore transfer system and oven system for Fan-out wafers cannot be used for Si wafers and vice versa.
Solution
- Enable both Fan-Out wafer boat and Si wafer boat to be placed in the same chamber
- Enable both boats to be transferd with one robot by exchanging the fingers according to the wafer processed
- Add the sensor to detect which kind of boat is transfered
Results
- Both Fan-Out wafers and Si wafers can be processed whith one clean oven system.
