Large Bore Vertical Furnace

This is a large-bore vertical furnace for heat treatment of RDL (Redistribution Layer) and glass interposers for advanced semiconductor packaging, as well as LCD, OLED (organic EL) and polyimide film.

Features

LCD/OLD : Compatible with 730×920 mm substrate (other sizes on request)
Interposer : Compatible with various substrates of 300×300 to 600×600 mm
The semiconductor diffusion furnace has been modified to a larger scale for the flat panel display
Normal pressure processing and decompression processing are possible
Large-scale LGO heater has excellent temperature characteristics

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Overview

This large-bore vertical furnace employs strict temperature characteristic control, atmosphere control and particle control, expertise for semiconductor manufacturing, for FPD. Quartz boats are used to create a low-particle, metal-free environment to enable vacuum heat treatment at 10 ppm or lower O2 concentration. This furnace is suitable for touch panel and other material contact annealing, post-baking and activation annealing. In addition, for advanced semiconductor packaging such as chiplet and 2.xD/3D, this furnace is available for various heat treatment of RDL (Redistribution Layer) based on glass substrate, glass interposer, etc.

Specifications

Model	VFS-4000
Outer dimension (mm)	W2000 × D2000 × H4350 (furnace body)
Heater	LGO heater
Operation temperature	200~600°C
Substrate size (mm)	LCD/OLED : 730×920 (other sizes on request) Advanced Semiconductor Packaging : 300×300, 510×515, 600×600
Batch size	24 wafers *For LCD/OLED : 730×920mm It may vary depending on wafer thickness and warpage.
Chamber material	High-grade quarts
Controller	Model VSC1000
Option	Forced-cooling system, HOST communication (SECS/GEM)
Applications	LCD/OLED : Contact Annealing, Post-bake, Activated annealing Advanced Semiconductor Packaging : Curing of RDL and PCB, Reflow after solder bumping