VF-5900 Vertical Furnace for 300-mm Wafers
This furnace is a heat treatment system for silicon wafer, IGBT, polyimide and thin wafer oxidation, diffusion and CVD. As our flagship model, this furnace is equipped with a large-capacity stocker and features a short cycle time.
Features
- Large batch, Max 100 wafers batch processing
- Max 16 FOUP stocks
- Excellent temperature control from low to medium high temperature range by use of LGO heater
- High-speed wafer transfer by use of single/five wafers handling robot
- Equipped with operator friendly high performance control system
Overview
This large-batch mass-production type vertical diffusion furnace can process a maximum of 100 wafers (300-mm / 12-inch) or 16 FOUPs a batch. An LGO heater is used for superior temperature characteristics from low temperatures to medium high temperatures. In addition to silicon wafers, the furnace is suitable for IGBT, polyimide, thin wafer and other material heat treatments.
Specifications
| Outer dimension | W1250 × D3200 × H3450 mm |
|---|---|
| Heater | LGO heater |
| Flat zone length | 1040 mm |
| Wafer size | 300 mm |
| Batch size | 100 wafers |
| I/O port | 2 |
| Number of FOUP stock | 16 |
| Finger | 5 wafers + single wafer |
| HOST communication | HSMS/GEM300 |
| Options | Forced-cooling system N2 load lock |
