VF-3000HLP Activation Annealing Furnace
A vertical furnace enabling ultra high-temperature processing, ideal for power device manufacturing. Supports 3- to 8-inch wafers and has an automatic wafer transfer mechanism. Can be used for applications ranging from R&D to mass production.
Features
- Supports lot sizes ranging from mini-batches to 50 wafers, and applications ranging from R&D to use on mass-production lines.
- Supports a wide range of wafer sizes from 3 to 8 inches.
- The furnace interior features our proprietary metal-free construction.
- Enables temperature monitoring in wafer vicinity.
- An N2 load lock is provided as a standard feature.
- High-throughput cassette-to-cassette transport
- H2 atmosphere annealing with trench rounding is available as an option.
Overview
VF-3000HLP is a vertical furnace that can process lots ranging from mini-batches to 50 wafers, and a wide range of wafer sizes from 3 to 8 inches. Carefully selected hardware and control system features enable applications ranging from R&D to use on mass-production lines. The furnace interior features our proprietary metal-free construction. VF-3000HLP can process test devices (without wafer transfer), and supports ultra high-temperature activation annealing processes.
Specifications
| Operating temperature range | 700 to 1,900°C (700 to 1,800°C for H2 annealing) |
|---|---|
| Supported wafer sizes | 3 to 8 inches |
| Maximum lot size | 50 wafers |
| Gases used | N2, Ar, H2 (option) |
| Applications | SiC power devices, R&D, mass production, activation annealing |
Applications
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Related Solution Cases
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[case-003] Reducing Initial Cost
Providing SiC activation annealing equipment offering good value
- Activation
- VF-3000H
