VF-3000 Low-Cost Mini Batch Vertical Furnace
Overview
This furnace can be used for a wide range of wafer sizes from 4-inch to 8-inch, and processing in 50–75 wafers of mini batches can be chosen. With the hardware and control system content carefully selected to achieve a low price, this vertical furnace can be used for a wide range of functions from R&D to mass-production lines. Choose and use a suitable heater from an LGO heater, molybdenum disilicide (MoSi2) heater and carbon heater not only for low-temperature annealing, nitride (Si3N4), polysilicon (poly Si) and other material LPCVD, oxidation and diffusion but also for SiC power device gate silicon oxynitriding, activation annealing and other ultra-high-temperature treatment processes.
Specifications
Outer dimension | W1200×D1450×H2610 mm |
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Heater | LGO heater |
Flat zone length | to 360 mm |
Wafer size | 4 to 8 inch |
Batch size | Max. 75 wafers(50 wafers at 8 inch) |
I/O port | 4 |
Number of cassette stock | 4 |
Finger | Single wafer |
Options | Forced-cooling system N2 load lock Convertible wafer size |
Applications
Customize
Related Solution Cases
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[case-009] Energy Saving of Vertical Furnace for Low Temperature Range
Improvement of vertical furnace to energy saving by optimizing thermal insulation design
- Polymide curing
- VF-3000(B)
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[case-008] Improving Productivity (reconfiguration of the treatment process)
Significantly improving productivity with a high-performance vertical furnace
- Annealing
- VF-3000(B)
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[case-002] Establishment of the VCSEL Process
Significant yield improvement was achieved with a special VCSEL-process dedicated furnace.
- Thermal oxideation
- VF-3000(B)