SO2-12-F Heated-air Circulating Type Clean Oven for 300-mm Wafers
This clean oven processes 300-mm (12-inch) wafers for semiconductor production.
With FOUPs, 50 wafers can be fully automatically processed for each chamber. The system can be used for low-temperature processing of polyimide and other materials.
Features
- Fully automatic clean oven for FOUP operation
- Max 50 wafers per chamber
- One robot is available for 2 chambers
- 2 FOUPs per chamber
- High speed wafer transfer by double wafer handling robot
Overview
This clean oven for semiconductor production was developed by introducing the best-selling FPD manufacturing equipment, single wafer processing clean oven. This oven can run fully automatically using 300-mm (12-inch) FOUPs. 50 wafers can be processed for each chamber and up to 2 chambers can be installed (2 FOUPs are used for each chamber). High throughput in a short cycle time is realized in low-temperature processing of polyimide and other materials.
Specifications
| Outer dimension | W3000×D3105×H2200 mm (2 chamber type) |
|---|---|
| Heating method | Heated-air circulating |
| Heater | Sheathed heater |
| Operation temperature | 70 to 450°C |
| Flat zone length | 500mm |
| Wafer size | 300mm |
| Batch size | 50 wafers |
| I/O port | 2 or 4 |
| Finger | 2 wafers |
| HOST communication | HSMS/GEM300 (Option) |
| Option | Notch aligner Fan-out Convertible 8 inch |
Applications
Customize
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