Heated-air Circulating Type Clean Oven
This clean oven for mass production can be used for various heat treatment in packaging processes, equipped with automatic substrate transfer mechanism supports various square substrates (up to 600x600mm) for chiplet and 2.xD/3D advanced semiconductor packaging, in addition to Φ300mm wafers in which we have extensive experience in polyimide cure processing of FO-WLP and WL-CSP.
Low temperature processing such as polyimide curing is also available.
Features
- Available for heat treatment of advanced semiconductor packaging such as chiplet and 2.xD/3D
- Compatible with Φ300mm and square substrates up to 600 x 600mm
- Fully automatic clean oven for FOUP operation
- One robot is available for 2 chambers
- 2 FOUPs per chamber
- High speed wafer transfer by double wafer handling robot
Overview
This clean oven for semiconductor production was developed by introducing the best-selling FPD manufacturing equipment, single wafer processing clean oven. For advanced semiconductor packaging such as chiplet and 2.xD/3D, this oven can be used for heat treatment of Si interposer, RDL (Redistribution Layer) of organic and glass interposer, etc., supporting various substrates up to 600×600mm in size, including Φ300mm. This oven is also available for drying of printed circuit board, reflow after solder bumping, and baking after chip molding. Especially in low-temperature processing such as polyimide curing, high throughput in a short cycle time is realized.
Specifications
| Model | SO2-12-F / SO2-30-F | SO2-12L-F / SO2-30L-F | SO2-60-F |
|---|---|---|---|
| Heating method | Heated-air circulating | ||
| Heater | Sheathed heater | ||
| Operation temperature | 70 to 450℃ | 70 to 400℃ | 70 to 300℃ |
| Wafer size (mm) | Φ300 300 × 300 |
Φ300 300 × 300 |
510 × 515 600 × 600 |
| Batch size* | 50 wafers | 52 wafers | 12 wafers |
| I/O port | 4 | ||
| Finger | 2 wafers | ||
| HOST communication | HSMS/GEM300 (Option) | ||
* It may vary depending on wafer thickness and warpage.
Applications
Customize
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