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RLA-4106-V Lamp Annealing System for Contact Annealing

Vacuum load-lock capability improves throughput.
Supports various wafers including Si, GaN, and SiC.

Features

  • Vacuum load-lock is equipped as standard on the chamber and transport unit, for high throughput.
  • Includes an automated susceptor transfer function for SiC and GaN wafers.
  • Halogen lamps are installed in both an upper and lower cross.
  • 6 zone control allows easy control of the power ratio for each zone.
  • Non-contact measurement of workpiece temperature is performed using radiative thermometers, and feedback control is possible.
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Overview

This is production equipment that uses multiple halogen lamps arranged in an upper and lower cross as the heat source, and is intended for rapid, high-precision annealing of wafers. The use of a newly developed vacuum transport platform enables workpiece transport and treatment in an ultra-low oxygen atmosphere.

Specifications

Operating temperature range 400 to 1200°C
Temperature rise rate Max. 200°C/sec
Lamp array Top/bottom surface cross-array
Number of control zones 6
Wafer size (mm) Φ150　* Φ200 mm size can also be processed.
Wafer transport Vacuum-capable clean robot
Treatment Annealing, oxidation
Workpieces Si, SiC wafers, GaN, others
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