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Lamp Annealing System for Contact Annealing (Vacuum load-lock transport)

Vacuum load-lock capability improves throughput.
Supports various wafers including Si, GaN, and SiC.

Features

  • Vacuum load-lock is equipped as standard on the chamber and transport unit, for high throughput.
  • Includes an automated susceptor transfer function for SiC and GaN wafers.
  • 6 zone control allows easy control of the power ratio for each zone.
  • Non-contact measurement of workpiece temperature is performed using radiative thermometers, and feedback control is possible.
  • New 2-chamber type has been added to the lineup. Combined with optimization of the transport and cooling sections, productivity is 2 to 2.4 times higher than that of conventional model (RLA-4200-V).
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Overview

This is production equipment that uses multiple halogen lamps arranged in an upper and lower cross as the heat source, and is intended for rapid, high-precision annealing of wafers. The use of a newly developed vacuum transport platform enables workpiece transport and treatment in an ultra-low oxygen atmosphere.

Specifications

Model RLA-4200-V RLA-4100-V
Outer dimension (mm)

*Not including gas box and console

 W3300 × D4850 × H2430 W1800 × D2800 × H2275
Wafer size (mm) ～Φ200
Operating temperature range 400 to 1200°C
Number of stockable carriers 2 1
Number of process chambers 2 1
Temperature rise rate Max. 200°C/sec (Si Wafer processing)
Max. 50°C/sec (SiC Wafer processing)
Lamp array Top/bottom surface cross-array
Number of control zones 6
Wafer transfer Single wafer / Vacuum-capable clean robot
Treatment Annealing, Oxidation
Workpiexes Si, SiC wafers, GaN, others
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