CLH Series High-Temperature Clean Ovens
Overview
2 types of hot-air blowers are available, side blower type (type III) and front side blower type (type V). The clean ovens are equipped with heat-resistant high-performance filters and our unique cooling units that enable high-temperature processing at up to 530°C (or up to 500°C with type V). Thanks to the excellent temperature uniformity achieved by the hot-air circulation system and class 100 air cleanliness (when the temperature is stable), the clean ovens are optimal for semiconductor wafer and glass substrate baking, aging and other purposes requiring high-temperature and high-accuracy processing. N2 gas can also be introduced into the chamber to use the oven at 20 ppm or lower residual O2 concentrations.
High-temperature baking is enabled by a heat-resistant high-performance filter and our unique cooling unit.
Applications | Baking and curing for semiconductor wafers and glass substrates |
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Options | Oxygen concentration meter, signal tower, cold trap, emergency stop, water leak detector |
Specifications
Outer dimension | CLH-21CD(H) W1285×D1605×H2020 mm CLH-35CD(H) W1285×D1775×H2080 mm |
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Inside dimension | CLH-21CD(H) W670×D500×H700 mm CLH-35CD(H) W670×D670×H790 mm |
Heating method | Heated-air circulating |
Heater | Sheathed heater |
Operation temperature | 100 to 450°C (Std.-type) 100 to 530°C (H-type) |
Wafer size | φ100 to 300mm Other(Rectangular substrate etc) |
Batch size | 25 to 200 wafers (1 to 8 cassettes) |
Standard accessory | Shelf plates (2 plates) Loading capacity 15kg/plate |
Option | Oxygen analyzer |