New Models of Heat Treatment Equipment for SiC Power Semiconductors: Contribute to Improving Productivity

We developed newly 2 models of heat treatment equipment that can significantly improve productivity of SiC Power Semiconductors.

[ Contact Annealing System “RLA-4200-V“ ]

We has been manufacturing and selling contact annealing systems, such as “RLA-4100-V” and “RLA-3100-V”, winning favorable reviews from many customers for many years.
However, since these heat treatment systems are single-wafer systems that process one wafer at a time, there has been a need for further productivity improvements.
Our new model : RLA-4200-V has 2 process chambers (previous models above mentioned have only 1 chamber) and newly designed transfer mechanism that can transfer wafer effectively, achieving 2 to 2.4 times higher productivity than previous models.

[ Activation Annealing System “VF-5300HLP“ ]

VF-5300HLP is a batch processing vertical furnace.
Last year we provided this furnace with capability of
processing 100 wafers of 6 inch / 8 inch at a time
first in the industry.
And this time, we developed new wafer transfer
mechanism which can transfer next lot of wafers while
previous lot of wafers being processed, reducing wasted
time significantlyand increasing productivity by 25%.

These two models will be introduced at SEMICON^® Japan 2024 (December 11-13, 2024 at Tokyo Big Sight). Please visit us at our booth (Booth No. 5121, East Hall 5) where our sales staff will explain the details.

We JTEKT TTHERMO SYSTEMS aims to be a “solution provider that creates the future of the mobility society through manufacturing and manufacturing facilities” by proposing solutions to society's problems with our heat treatment technology.