These inert gas ovens provide treatment in a low-oxygen atmosphere with superheated steam and a reduced footprint.
Ideal for debinding treatment of MLCC and LTCC, electrostatic chucks, and other electronic and ceramic components.
This multi-purpose heat treatment equipment provides treatment in low-oxygen atmospheres with superheated steam.
It can be used for debinding treatment of MLCC and LTCC, electrostatic chucks, and other electronic and ceramic components, as well as drying and degreasing of metal components.
These continuous furnaces provide treatment in low-oxygen atmospheres with superheated steam, and feature a reduced footprint.
It can be used for debinding and firing of MLCC and LTCC, electrostatic chucks, and other electronic and ceramic components, as well as drying and degreasing of metal components.
The use of a metal muffle provides these models with excellent soaking performance.
In addition, the good airtightness of the muffle allows the formation of an atmosphere inside the furnace that has excellent stability and reproducibility.
The use of our proprietary Moldatherm heater with excellent heat insulation performance and heating/cooling characteristics results in a system that delivers high-precision temperature control and superior energy savings.
Ideal for firing of thick substrates such as conductors, resistors, and glass, as well as brazing, soldering, electrode drying, and debinding treatment.
These mesh belt continuous type furnaces are intended for brazing of various metals, glass sealing, and other reducing atmosphere treatments.
The hydrogen atmosphere system equipped with safety mechanism is easy to use.
In addition to brazing, reflow, metallizing, and glass sealing in a hydrogen (reducing) atmosphere, these furnaces can also be used for bright treatments.
Based on the latest gas control technologies, these models allow atmosphere separation that can finely control the gas composition in the target zone. (Examples: high oxygen concentration in the low-temperature zone, medium oxygen concentration in the mid-temperature zone, low oxygen concentration in the firing zone).
Ideal for heat treatment of LTCC substrates and MLCC, inductor production, and powder metallurgy sintering. Also delivers good results as a copper (Cu) paste firing furnace.
These compact conveyor furnaces for experiments (R&D) are fully equipped to support all kinds of atmospheres for the manufacture of electronic components including air, N2, and hydrogen (reducing) atmospheres.
The purge chambers installed at the entrance and exit allow excellent stability and reproducibility of the atmosphere inside the furnace.
This product uses a special ceramic chain with excellent heat and wear resistance as the transport conveyor, allowing it to be used for high-temperature treatments such as ferrite sintering, and MLCC firing and reoxidation.
Select from a low- and medium-temperature range ceramic conveyor with heat resistance up to 1200°C, or a high-temperature ceramic conveyor using mullite with excellent high-temperature strength and heat resistance up to 1400°C.
For the muffle as well, select muffleless configuration, ceramic muffle, or metal muffle.
The use of a ceramic semi-muffle can eliminate metal contaminants inside the furnace, allowing it to be used for a wide range of applications including high-temperature glazing of glass and other materials, and firing of capacitors, thermistors, and other electronic components.
When used in combination with a metal muffle, firing can be performed in an environment with less metal scale compared to a mesh belt furnace.
With this series, a high maximum operating temperature of 600℃ is available, together with a nitrogen (N2) atmosphere that yields low oxygen (O2) concentration of 20 ppm.
These products have been delivered in large quantities for degreasing of ceramic parts (*) and various anti-oxidation treatments.
The furnace external cooling mechanism using cooling blowers shortens the cooling time without affecting the atmosphere inside the furnace.
* Separate safety equipment is required. Please contact us from General Inquiries.
It is recommended that these products be used in combination with heater-type exhaust gas treatment equipment.
A heat-resistant, high-performance filter and our unique cooling unit enable high-temperature baking in a clean environment (max. 530°C (max. 500°C for the V model)).
The hot-air circulation system allows excellent temperature uniformity and class 100 air cleanliness (when the temperature is stable).
This type of oven is optimal for semiconductor wafer and glass substrate baking, as well as aging and other heat treatments that require high temperature and high accuracy.
Heat treatments at 20 ppm or lower residual O2 concentrations is available by introducing nitrogen (N2) gas into the chamber.
