This furnace is a heat treatment system for silicon wafer, IGBT, polyimide and thin wafer oxidation, diffusion and CVD. As our flagship model, this furnace is equipped with a large-capacity stocker and features a short cycle time.
This heat treatment system performs silicon wafer, IGBT, polyimide and thin wafer oxidation, diffusion and CVD. Since its height is less than 3000 mm, this model can be easily introduced. It features a short cycle time and high throughput.This clean oven for mass production can be used for various heat treatment in packaging processes, equipped with automatic substrate transfer mechanism supports various square substrates (up to 600x600mm) for chiplet and 2.xD/3D advanced semiconductor packaging, in addition to Φ300mm wafers in which we have extensive experience in polyimide cure processing of FO-WLP and WL-CSP.
Low temperature processing such as polyimide curing is also available.
